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Title3D Computational Image Sensors For Advanced Low Power Visual Processing
Technical PIsLisa McIlrath, Paul Zavracky
PI Phones(617) 373-3058, (617) 373-2919
PI Emaillgdm@ece.neu.edu, zavracky@ece.neu.edu
OrganizationNortheastern University
LocationBoston, Massachusetts
Agent/ContractsSSCOM, (508) 233-5071
Web Sitehttp://www.ece.neu.edu/edsnu/Device.html

Project Goals

The 3D computational image sensors program proposes to develop sensors which will allow high speed, high resolution image processing in compact low power portable systems. These systems will be combined with high density optical storage media operated through a belt-worn read/write driver to provide rapid storage and retrieval of information.

The research team at Northeastern University, in conjunction with Kopin and Polaroid Corporations, will develop the technology required to build 3-dimensional structures combining large array imagers with stacked interconnected processing layers. The proposed technology is radically different from current multi-chip module approaches for 3D integration which require interconnect lines to be brought to the periphery of the chip stack. Our technology will allow virtually unrestricted placement of vias connecting the stacked processing layers within the interior of the chip.

Each layer will be processed through a foundry in a CMOS process optimized for SOI material. The top-most layer of the 3D sensor will include the imaging function and will require fabrication of an array of active pixels. The processing layers will include circuits for performing image filtering in the analog domain, low power A/D converters, memory buffers, and isolated digital processing elements for specific computations, all optimized for design in SOI technology.

Recent Accomplishments

Milestones